EETimes (25)

Power SiC for Everyone

NCSU researchers have implemented the cheap-to-license PRESiCE process at TI's X-Fab as an alternative to proprietary silicon carbide processes for power devices.

Globalfoundries Reportedly Asks EU to Probe TSMC

Globalfoundries has asked European regulators to investigate rival chip foundry TSMC, accusing its larger competitor of unfair competition, according to a report by the Reuters news service.

Google Buys HTC's Pixel Team

Search engine giant makes second major foray into smartphones.

Winner-Takes-All Strategy at Customers' Expense?

Competitors, partners, and customers in our interdependent semiconductor industry often have mutual interests that could benefit from cooperation. By offering customers efficiency, we'd all win. Sadly, that's not how things often work.

7 Views of Globalfoundries in 2017

Globalfoundries announced 12-nm FinFET and RF-SOI processes as part of an annual update on its road map.

MediaTek, Huawei Partner in 5G Development

MediaTek and Huawei, China's largest mobile phone maker, have completed 5G tests in Beijing with the aim of building an industry ecosystem that includes 5G terminals, chipsets, instruments, and networks.

AMD Copilots Tesla AI Chip, Says Report

Tesla is collaborating with AMD on a machine-learning ASIC for its self-driving cars that could replace Nvidia GPUs that the car maker uses, said a report.

EDICON: Views from the Exhibits

The second EDICON USA took place in Boston from September 11 to 13. Here is some of what EE Times saw on the exhibit floor.

Nest Targets Home Security Market

Nest unveiled the next phase of its strategy to enable the connected home, rolling out a suite of products for the retail home security market.

DeepScale on Robo-Car: Fuse Raw Data

DeepScale has developed a perception system for ADAS/autonomous vehicles. It offers pre-trained AI algorithms, based on raw data, not object list, coming from multiple sensory data types, and accelerates its fusion on an embedded processor like Snapdragon.

Toshiba Agrees to Sell Chip Unit to Bain-led Group

Latest twist in months-long saga has Toshiba agreeing to sell for $18 billion to group that includes Apple, Dell and sk Hynix, leaving Western Digital out in the cold.

DDR5 Runs in Rambus' Labs

Rambus has working chips in the lab for DDR5, the next-generation DRAM bus while the industry debates the road ahead for memory in servers.

Smartphones: Have NFC Will Travel

Vendors of smartphones - both Android and iPhone - are putting an NFC reader in the hands of consumers, making NFC a globally interoperable platform to connect, commission, and control things with NFC tag. IoT is NFC's next big opportunity.

Fab Tool Spending on Pace to Shatter Record

Combined spending on new and refurbished front end fab tools is expected to grow 37 percent this year and obliterate the previous record set in 2011.

NOR Flash Standard Meets Instant-On Expectations

IoT applications need a richer complement of memory than most MCUs offer, and the bandwidth of serial NOR flash make it a logical solution to the problem.

The U.S., China and the Chip Industry

Beijing cried foul over Trump's decision to block the acquisition of Lattice Semiconductor. It should be prepared for more of the same.

Too Many Cars, Too Few Resistors

The increasing amount of electronics in vehicles is creating a shortage of resistors, reports EBN.

Synopsys Buys Materials Modeling Tool Firm QuantumWise

Deal enables Synopsys to offer customers seamless flow from materials to transistor by creating models for TCAD process and device simulation.

Left Unsaid in Waymo-Intel Deal

Left unsaid in the announcement is what this new partnership entails, and on whose chip Waymo is running the heavy-duty deep-learning algorithms.

Synopsys Teams With SMIC, Brite Semi on IoT Platform

Platform based on Synopsys ARC Data Fusion IP subsystem said to simplify design, reduce costs.

Engineers Developing High-Tech Solutions To Mitigate Natural Disasters, Aid Relief Efforts

In the coming months, AspenCore will be publishing a series of features online and in print profiling some of the engineer-initiated disaster relief programs that we like and recommend to our readers.

Cellular Puts IoT on Speed Dial

Carriers laid out their plans for cellular IoT variants LTE-M and NB-IoT at last week's Mobile World Congress Americas.

DARPA Heeds Moore's Wisdom

DARPA added six programs to its Electronics Resurgence Initiative to address the problems that Gordon Moore 50 years ago predicted would loom at the end of today's silicon roadmap.

17 Views of Mobile World Congress

Carriers and their suppliers showed efforts in Gbit 5G and Kbit IoT networks and the handsets, smartwatches and nodes that ride them at Mobile World Congress Americas.

AI Reshaping Fab Operations

Chipmakers are adopting artificial intelligence to boost fab operations, and the effort is starting to pay off, according to Micron Technology.